The
components in this phase are marked with letter
H in
suffix.
For
schmematic diagram and component list refer to Assembly
manual which is enclosed with your kit.
Assembly of oven circuit
Schematic diagram
Click Picture
to Enlarge
Component placement
Click Picture
to Enlarge
Install resistors R1H, R2H, R4H, R5H, R6H, R7H, R8H,
R9H and R10H.
Install diode D1H.
Install capacitors C1H, C2H, R1H,
C3H, C4H, C5H and C6H.
Install integral circuit IC2H.
Installation of TR1H
Bend the leads of TR1H as per photo.
Insert TR1H over the Si570. Make sure that TR1H heatsink is completely covering top surface of Si570. Solder it
and then bend the TR1H pins very gently downwards to ensure good thermal contact.
Installation of IC1H
Bend the leads of IC1H as per photo. Apply a bit of glue on top of the flat side.
Position IC1H as per photo and glue it to heatsink of TR1H. Do not solder IC1H until glue sets firmly.
Once the glue is dry and set, press both IC1H and TR1H downwards so that heatsink of TR1H has good thermal contact with Si570.
Finally, solder the pins of IC1H.
Warning: do not apply any glue between TR1H and Si570.
Install jumper KS1H.
Adjustment
Adjust trimmer R3H so the voltage on pin 5 of IC2H is exactly 3.28 V.
After the adjustment check the voltage on pin 3. The
voltage on pin 3 will be around 3.10 V and if the quasi
oven is installed properly the voltage will slowly rise at
rate of 0.02 V per minute until it reaches 3.28 V. At that
point the temperature of Si570 will stabilize at 55C
Celsius [131 Fahrenheit].
This completes the installation of Si570 quasi oven circuit.
Next phase: ...
Block
Diagram | Phase
1: Power Supply | Phase
2: Microcontroller circuit | Phase
3: Local osciallator Si570 |
Phase 4: G59 USB connection | Phase
5: G59 Receiver assembly | Phase 6: G59 Input-Output HP-LP Filters |
Phase 7: Band pass filters and control logic
| Phase 8: CW monitor
| Phase 9: Transmitter circuits assembly |
Phase 10:
Microphone preamplifier
| Phase 11: Si570 Quasi oven circuit
| GBOX assembly
|
